1 - 20 of 62 results
Title: Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan / Edition 1, Author: K. Otsuka
Hardcover $359.20 $449.00 Current price is $359.20, Original price is $449.00.
Title: Principles of Electronic Packaging / Edition 1, Author: Donald P. Seraphim
Hardcover $104.29 $119.10 Current price is $104.29, Original price is $119.10.
Title: Boundary-Scan Interconnect Diagnosis / Edition 1, Author: Josï T. de Sousa
Paperback $205.58 $219.99 Current price is $205.58, Original price is $219.99.
Title: Hermeticity of Electronic Packages, Author: Hal Greenhouse
Hardcover $189.00 $225.00 Current price is $189.00, Original price is $225.00.
Title: IC/Package Design Integration (Ipdi, `98), 1998 IEEE Symposium On, Author: IEEE
by IEEE
Paperback $99.00 $110.00 Current price is $99.00, Original price is $110.00.
Title: Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach / Edition 1, Author: Pradeep Lall
Hardcover $152.62 $185.00 Current price is $152.62, Original price is $185.00.
Title: Electronic Equipment Packaging Technology / Edition 1, Author: Gerald L. Ginsberg
Title: Thermal Management Handbook: For Electronic Assemblies / Edition 1, Author: Al Krum
Title: Electronic Packaging Materials and Their Properties / Edition 1, Author: Michael Pecht
Hardcover $151.98 $175.00 Current price is $151.98, Original price is $175.00.
Title: Electronic Physical Design / Edition 1, Author: Barry M. Lunt Ph.D.
Hardcover $151.02 $172.60 Current price is $151.02, Original price is $172.60.
Title: Failure Modes and Mechanisms in Electronic Packages / Edition 1, Author: P. Singh
Hardcover $185.69 $249.99 Current price is $185.69, Original price is $249.99.
Title: Laser Diode Chip and Packaging Technology, Author: Pei C. Chen
Paperback $55.11 $66.00 Current price is $55.11, Original price is $66.00.
Title: Materials for Electronic Packaging, Author: Deborah D.L. Chung
Hardcover $229.20 $300.00 Current price is $229.20, Original price is $300.00.
Title: Circuits, Interconnections and Packaging for VLSI / Edition 1, Author: H. B. Bakoglu
Hardcover $52.87 $62.95 Current price is $52.87, Original price is $62.95.
Title: Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Author: Taylor and Francis
Hardcover $145.15 $175.95 Current price is $145.15, Original price is $175.95.
Title: Electronic Packaging of High Speed Circuitry / Edition 1, Author: Stephen G. Konsowski
Hardcover $51.02 $65.00 Current price is $51.02, Original price is $65.00.
Title: MCM C/Mixed Technologies and Thick Film Sensors / Edition 1, Author: W.K. Jones
Title: Practical Guide To The Packaging Of Electronics: Thermal And Mechanical Design And Analysis, Second Edition / Edition 2, Author: Ali Jamnia
Hardcover $144.37 $175.00 Current price is $144.37, Original price is $175.00.
Title: Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products, Author: Suresh Sitaraman
Paperback $99.00 $110.00 Current price is $99.00, Original price is $110.00.
Title: Lead-Free Soldering in Electronics / Edition 1, Author: Katsuaki Suganuma
Hardcover $189.75 $230.00 Current price is $189.75, Original price is $230.00.

Pagination Links