Evaluation Findings of Bondade CU-31 Bonding Solution: Technical Evaluation Report

Evaluation Findings of Bondade CU-31 Bonding Solution: Technical Evaluation Report

by Highway Innovative Technology Evaluation Center Staf

Paperback

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Overview

Prepared by the Highway Innovative Technology Evaluation Center (HITEC), a CERF Service Center.

The report describes a HITEC evaluation of Bondade CU-31 Bonding Solution, manufactured by Transpo Industries. The reportdescribes a three-year program of field testing and evaluation designed to determine the effectiveness of Bondade CU-31 in extending the service life of pothole repairs.

Product Details

ISBN-13: 9780784403488
Publisher: Civil Engineering Research Foundation (CERF)
Publication date: 01/01/1998
Series: Civil Engineering Research Foundation Reports
Pages: 58
Product dimensions: 0.43(w) x 0.35(h) x (d)

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